Winbond, the Taiwan memory producer, is collaborating with Ambiq, the MCU and real-time clock specialist, to combine Winbond’s HyperRAM and Ambiq’s Apollo4 SoC to deliver system chips for IoT endpoints and wearables. Several customers are in design with Ambiq’s Apollo4 and Winbond 256Mbx8 HyperRAM Hybrid Sleep Mode (HSM), with volume production expected in 2022. HSM …
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